Transcend Information announced 8GB DDR3-1066 Registered DIMM (RDIMM) and 4GB DDR3-1333 VLP (Very Low Profile) RDIMM modules. Featuring enhanced capacity, support for triple-channel memory configurations, and an onboard thermal sensor, these new high-density RDIMMs provide for higher data frequencies and significantly increase memory space.
-P/N: TS1GKR72V1N, 8GB, 1066MHz DDR3 REG DIMM (Quad Rank, x8) with thermal sensor.
-P/N: TS512MKR72V3NL, 4GB, 1333MHz DDR3 VLP REG DIMM (Dual Rank, x8) with thermal sensor.
As Transcend’s highest density DDR3 module, the 8GB DDR3-1066 RDIMM is constructed with a ten-layer PCB that offers stable performance and durability, and also includes a high thermal efficiency aluminum heatsink. Offering memory bandwidth up to 8.5GB/s and the flexibility to expand maximum capacity to 48GB (per processor), the 8GB DDR3-1066 RDIMM module allows administrators to create a robust infrastructure that runs memory-intensive applications such as virtualization and cloud computing with ease.
Transcend’s 4GB DDR3-1333 VLP RDIMM is 0.74-inch high – compact enough to fit into space-restricted cases, 1U height rack systems or blade servers. When used with the triple-channel architecture built into Intel’s newest Nehalem-based Xeon server platforms, Transcend’s DDR3-1333 VLP RDIMMs enable system administrators to maximize memory bandwidth, providing up to 10.6GB/s throughput.
All of Transcend’s DDR3-1333/1066 RDIMMs fully comply with JEDEC standards and are made of 256Mx8 high-quality DDR3 FBGA chips. The modules are backed by Transcend’s lifetime warranty.
WareGround IT News: Transcend Releases 4GB, 8GB DDR3 RDIMMs For Cloud Computing and Server Applications
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